PLAPACS is a pre-molded air cavity plastic package for CCD/CMOS
image sensors.
The plastic package features a number of excellent characteristics
including:
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outstanding dimension accuracy |
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high humidity resistance |
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an excellent CTE match with PCB |
Mitsui Chemicals can design any type of plastic package based on your
needs and requirements by combining our superior molding method with
exceptional resin technology. Please
contact us if you would like to acquire a copy of our 48PINQFP design
or would like us to design a customized package for your electronic
or specialty application.
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